Computational Fluid Dynamics Analysis of Heat Sinks using Aluminum and Copper Materials

Abstract

The increasing power densities in electronic devices necessitate efficient thermal management solutions. Heat sinks, typically constructed from materials with high thermal conductivity, are essential in dissipating heat to maintain optimal operating temperatures. This study employs Computational Fluid Dynamics (CFD) to analyze and compare the thermal performance of heat sinks made from aluminum and copper. CFD simulations were conducted using ANSYS Fluent, focusing on parameters such as temperature distribution, pressure drop, and heat transfer coefficient under natural convection conditions. The results indicate that copper heat sinks exhibit superior thermal performance due to their higher thermal conductivity. However, aluminum heat sinks offer advantages in terms of weight and costeffectiveness. The study also explores hybrid designs, combining the high thermal conductivity of copper with the lightweight properties of aluminum, to optimize thermal management in electronic applications. These findings provide valuable insights for the design and selection of heat sink materials in electronic cooling systems.MDPI+1qats.com